Create and release your Profile on Zintellect – Postdoctoral applicants must create an account and complete a profile in the on-line application system. Please note: your resume/CV may not exceed 2 pages.
Complete your application – Enter the rest of the information required for the IC Postdoc Program Research Opportunity. The application itself contains detailed instructions for each one of these components: availability, citizenship, transcripts, dissertation abstract, publication and presentation plan, and information about your Research Advisor co-applicant.
Additional information about the IC Postdoctoral Research Fellowship Program is available on the program website located at: https://orise.orau.gov/icpostdoc/index.html.
If you have questions, send an email to ICPostdoc@orau.org. Please include the reference code for this opportunity in your email.
Research Topic Description, including Problem Statement:
Additively manufactured electronics, printed electronics, 3D electronics, flexible electronics and wearable electronics is a fast-growing market. It permits a move away from the wet chemistry processes which are energy intensive, labor intensive, plant equipment intensive, uses hazardous chemicals and produces significant waste streams with associated environmental disposal concerns.
This topic is focused on electrically functional materials which are required for fabricating a wide range of products cheaply and quickly with considerable geometrical complexity at low production quantities.
These electrically functional materials are required in several forms such as printable adhesives, printable inks or as bulk printable material, and must be capable of being printed using commonly available commercial process equipment such as UV Objet, Dragonfly, aerosol jet and piezoelectric nozzles, etc.
The current generation of printable electrically functional materials have several issues:
Thus it is challenging to move away from using wet chemistry based PCB fabrication, SMD components and the associated common bonding processes such as solder reflow.
To investigate new adhesives, inks and materials would take too long using conventional materials sciences in terms of discovery, screening, time consuming & labor intensive. The materials science space is too large & difficult to navigate quickly and efficiently.
The aim of this research topic is to encourage proposal submissions that use machine learning, artificial intelligence, neural networks and any other computational technique(s) to rapidly accelerate the discovery of candidate adhesives, inks and materials. The promising materials would then need to be screened to produce a shortlist of viable electrically functional materials.
Relevance to the Intelligence Community:
The ability to print fully assembled PCBs on a printer in a 3D geometrically complex shape would allow us to move away from the planar 2D limitations inherent in conventional PCB fabrication. An ECAD file generated elsewhere can be sent to a printer over the internet. With an improved range of electrically functional materials at its disposal, custom fullyelectricallyfunctional3DPCBswouldbetheoutputoftheprinter.
This allows the IC to be less reliant on full scale manufacturing capabilities, creating a mobile one stop shop for both prototyping and small production quantity runs of geometrically complex 3D electrically functional PCBs. This will also give the ability to be more responsive and agile to print of custom electronics meeting very specific and custom customer requirements.
Key Words: Electrically functional Adhesives, Electrically Functional Inks, Electrically Functional Materials, Machine Learning, Artificial Intelligence, Neural Networks, AME, Additive Manufactured Electronics. PCBS, Printed Circuit Boards, 3D Electronics, Printed Electronics, Roll to Roll, Adhesive, Ink, Electronic Material, Resistor, Resistivity, Capacitor, Capacitance,Semiconductor, Inductance. Inductor, Magnetic, Ferroelectric, Conductor, Conductivity, Piezoelectric, Piezoelectricity, Photovoltaic, Solar, Electromagnetic, Thermoelectric, Triboelectric, Antennas, Power Harvesting, RFID, Flexible Electronics, Wearable Electronics