DEVCOM-Soldier Center Food Science Internship
Click on Apply at the bottom of the opportunity to start your application.
The U.S. Army Combat Capabilities Development Command, Soldier Center (DEVCOM-SC) is offering an internship opportunity in the U.S. Army’s Food Additive Manufacturing (3D food printing) program.
What will I be doing?
As an Oak Ridge Institute for Science and Education (ORISE) participant at DEVCOM-SC, you will join a community of scientists, engineers and researchers in a research project designed to develop individually tailored ration components for Soldiers. Personalized nutrition will help to maximize the warfighter’s cognitive and physical performance, as well as aid in their recovery during field training and operational missions. As the selected candidate, you will have the opportunity to participate in research collaborations with many domestic and international partners from industry, academia, and federal on 3D food printing about other food-related technologies.
Why should I apply?
Under the guidance of a mentor, you will gain hands-on experience to complement your education and support your academic and professional goals. Along the way, you will engage in activities and research in several areas. These include, but are not limited to:
- Gaining experience on how evaluate and assess warfighter's personalized nutrition
- Learning to develop 3D food printing
- Increasing knowledge and understanding about food-related technologies
Where will I be located?
Natick, Massachusetts
What is the anticipated start date?
Exact start dates will be determined at the time of selection and in coordination with the selected candidate. Applications are reviewed on an ongoing basis and internships will be filled as qualified candidates are identified.
What is the appointment length?
This appointment is a six-month research appointment, with the possibility to be renewed for additional research periods. Appointments may be extended depending on funding availability, project assignment, program rules, and availability of the participant.
What are the provisions?
You will receive a stipend to be determined by DEVCOM-SC. The stipend range for this opportunity is $3,000-$5,000/month based on full-time participation. Stipends are typically based on a participant’s academic standing, discipline, experience, and research facility location. Other provisions may include the following:
- Health Insurance Supplement (Participants are eligible to purchase health insurance through ORISE)
- Training and Travel Allowance
Security Clearance
While participants will not enter an employment relationship with DoD or any other agency, this opportunity will require a suitability investigation/background investigation. Any offer made is considered tentative pending favorable outcome of the investigation.
About DEVCOM SC
The U.S. Combat Capabilities Development Command - Soldier Center (DEVCOM SC) is located at the U.S. Army Natick Soldier Systems Center in Natick, Massachusetts, under the Army's Futures Command. Stretching back to 1954, the CCDC Soldier Center's history of support for the Soldier has continued uninterrupted for more than six decades, with a focus on Soldier-related research, development, testing and evaluation efforts. If Soldiers wear it, eat it, sleep under it, or have it airdropped to them in theater, it can be traced back to the CCDC Soldier Center. Diverse expertise comprised of scientists, engineers, technologists and equipment designers, the CCDC Soldier Center provides a wide range of capabilities to the Soldier, to include field feeding and life support systems, protective clothing, precision airdrop systems, and ballistic, chemical and laser-protection systems, and human performance optimization. More information about DEVCOM-SC can be found at https://sc.devcom.army.mil/
About ORISE
This program, administered by Oak Ridge Associated Universities (ORAU) through its contract with the U.S. Department of Energy (DOE) to manage the Oak Ridge Institute for Science and Education (ORISE), was established through an interagency agreement between DOE and DoD. Participants do not enter into an employee/employer relationship with ORISE, ORAU, DoD or any other office or agency. Instead, you will be affiliated with ORISE for the administration of the appointment through the ORISE appointment letter and Terms of Appointment. Proof of health insurance is required for participation in this program. Health insurance can be obtained through ORISE. For more information, visit the ORISE Research Participation Program at the U.S. Department of Defense.
The qualified candidate will have a bachelor's degree in engineering or life health and medical science. Degree must have been received within five years of the appointment start date.
Highly competitive applicants will have prior lab experience working on food formulations and/or 3D food printing.
- US citizenship is required.
Application Requirements
A complete application consists of:
- Zintellect Profile
- Educational and Employment History
- Essay Questions (goals, experiences, and skills relevant to the opportunity)
- Resume (PDF)
- Transcripts/Academic Records - Please upload a copy of a transcript for your current or most recent degree program that meets the disciplinary qualifications of the opportunity. Click here for detailed information about acceptable transcripts.
- One Recommendation. We encourage you to contact your recommender(s) as soon as you start your application to ensure they are able to complete the recommendation form and to let them know to expect a message from Zintellect. Recommenders will be asked to rate your scientific capabilities, personal characteristics, and describe how they know you. You can always log back in to your Zintellect account and check the status of your application.
If you have questions, send an email to army-rdecom@orise.orau.gov. Please list the reference code of this opportunity DEVCOM-SC-2025-0002 in the subject line of the email. Please understand that ORISE does not review applications or select applicants; selections are made by the sponsoring agency identified on this opportunity. All application materials should be submitted via the “Apply” button at the bottom of this opportunity listing. Please do not send application materials to the email address above.
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