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The U.S. Department of Energy (DOE), Office of Energy Efficiency and Renewable Energy (EERE) High Performance Computing for Manufacturing (HPC4Mfg) Internship Program offers 10-week, hands-on, practical internships at DOE national laboratories.
Background
For half a century, America has led the world in high performance computing (HPC) thanks to sustained federal government investments in research and development and regular deployment of new systems. The strong synergy between hardware development and software and application development has been a defining strength of the U.S. approach. High Performance Computing for Manufacturing (HPC4Mfg) unites world-class computing resources and the expertise of national laboratories to deliver solutions that could revolutionize manufacturing.
The HPC4Mfg program is a partnership between the public and private sectors to facilitate the use of advanced computational techniques in the private sector with the aim of reducing national energy consumption. In the HPC4Mfg Internship Program, student projects typically involve demonstrating advanced simulation and modeling in topic areas such as materials, computational fluid dynamics, combustion and machine learning applied to scientific computational results. The HPC4Mfg program is a component of High Performance Computing for Energy Innovation initiative. More information about the program can be found at https://hpc4energyinnovation.llnl.gov/. This program is sponsored by the Advanced Materials and Manufacturing Technologies Office (AMMTO) within the U.S. Department of Energy (DOE), Office of Energy Efficiency and Renewable Energy (EERE).
Why should I apply?
As a participant in the EERE HPC4Mfg Internship Program, you will engage in research-level computational activities under the guidance of a mentor who is a technical staff scientist or engineer at a federal national laboratory. You will gain a competitive edge as you apply your education, talent, and skills to the research and development of projects focused on high performance computing (HPC). You will also be able to establish connections with DOE scientists and subject matter experts that promote long-term relationships between yourself, researchers, and DOE.
What will I do?
Internship activities will vary based on the assigned research project and hosting facility. You can choose the project you are most interested in for the summer! As part of your application, you will identify your top 3 research projects from the 2023 HPC4Mfg Project Catalog. You can review the catalog at ***https://orise.orau.gov/AMsummer/hpc/default.html*** by scrolling to the bottom of the webpage. While your preferences will be taken into consideration during the final selection process, it is not guaranteed that you will be offered one of the projects listed.
Benefits
Appointment Details
In response to the evolving situation related to the COVID-19 pandemic, hosting sites may modify their operation schedule and access to facilities to ensure the health and safety of their entire workforce while maintaining operational effectiveness. Hence, the appointment date and location are subject to change contingent on hosting site guidelines and may result in a virtual placement.
Review and Selection Process
Nature of Appointment
Participants will not enter an employee/employer relationship with ORISE, ORAU, DOE, or hosting laboratory. Instead, participants will be affiliated with ORISE for the administration of the appointment through the ORISE Letter of Appointment and Terms of Appointment.
For more information, contact us at AM.Internships@orise.orau.gov.
The EERE HPC4Mfg Internship Program is open to students and recent graduates who meet the following qualifications:
NOTE: Eligible disciplines can be found in the list below.
Additional Information:
For program details, please visit: https://orise.orau.gov/AMsummer/hpc/default.html
A complete application submitted by Friday, February 10, 2023; 5:00 PM Eastern Time Zone consists of:
Submitted documents must have all social security numbers, student identification numbers, and/or dates of birth removed (blanked out, blackened out, made illegible, etc.) prior to uploading into the application system. All documents must be submitted via Zintellect. All application components must be received in the system to be considered.
For additional information or questions, feel free to contact us at AM.Internships@orise.orau.gov. Please list the reference code [DOE-EERE-HPC-2023] for this opportunity in the subject line of your email.
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