Create and release your Profile on Zintellect – Postdoctoral applicants must create an account and complete a profile in the on-line application system. Please note: your resume/CV may not exceed 2 pages.
Complete your application – Enter the rest of the information required for the IC Postdoc Program Research Opportunity. The application itself contains detailed instructions for each one of these components: availability, citizenship, transcripts, dissertation abstract, publication and presentation plan, and information about your Research Advisor co-applicant.
Additional information about the IC Postdoctoral Research Fellowship Program is available on the program website located at: https://orau.org/icpostdoc/.
If you have questions, send an email to ICPostdoc@orau.org. Please include the reference code for this opportunity in your email.
Research Topic Description, including Problem Statement:
Aerosol-jet printing methods have been utilized to successfully fabricate multi-layer circuits with the power supply (PS), digital interface (DI) circuit, and electrical ball grid array (BGA) connections for chips. The PS and BGA parts have gone through extensive accelerated life-time testing and have been shown to work on-par with the conventional electronic parts from which they were modeled. In fact, the BGA parts have displayed robust performance and the DI circuit functionality has been demonstrated at GB data rates. However, limitations associated with the fabrication of these circuits are related to lack of determination of long term reliability of low temperature material sets (process ability below 150 °C), fabrication onto flat surfaces, and electronic components that are surface mounted after fabrication of the circuit.
In order to overcome these limitations and advance fabrication capabilities, the following topics require investigation: (1) identify and characterize ink materials that can be processed at temperatures (i.e., below 150 °C) without loss in performance (i.e., better than 6x10-8 ?m for conductive materials, good electrical insulation for dielectric inks, dimensional stability for structural inks, and adhesions that survive the ‘scotch tape test’); (2) develop printing methods for the fabrication of circuits onto non-flat, 3D printed surfaces; and (3) develop methods for integrating/embedding components into these circuits during fabrication.
Example Approaches:
Direct-write printing of electronic circuits onto complex surfaces for production level fabrication of 3D printed hybrid electronics will require multiple capability advancements. Proposed approaches could pursue:
Design capabilities based on additive manufacturing methods that can automatically generate printable toolpaths requiring minimal manual intervention.
Materials sets formulated for specific functionality, printability and process ability that are compatible with low temperature substrates and components.
Tool platforms that can accept the specified toolpaths and enable printing of the above materials sets onto 3D surfaces.
Improved processing/printing capabilities that can combine advancements in order to fabricate the desired electronic circuits.
Accelerated life-time testing and analysis to verify that the fabricated electronics can function as required in real world settings.
ORISE GO
The ORISE GO mobile app helps you stay engaged, connected and informed during your ORISE experience – from application, to offer, through your appointment and even as an ORISE alum!
You gave a rating of 0 star(s)
SECURITY/PRIVACY NOTICE
By continuing to use this system you indicate your awareness of and consent to the following terms and conditions of use. LOGOUT IMMEDIATELY if you do not agree to the conditions stated in this warning.
SECURITY NOTICE
This system is part of a Federal information system. This system is monitored for security purposes to ensure it remains available to all users and to protect information in the system. The system employs software programs to monitor network traffic to identify unauthorized activities. By accessing this system, you are expressly consenting to these monitoring activities. Unauthorized attempts to defeat or circumvent security features; to use the system for other than intended purposes; to deny service to authorized users; to access, obtain, alter, damage, or destroy information; to upload or change information; to otherwise cause system or information damage; or otherwise to interfere with the system or its operation, is prohibited. Evidence of such acts may be dis-closed to law enforcement authorities and result in prosecution under the Computer Fraud and Abuse Act of 1986 and the National Information Infrastructure Protection Act of 1996, or other applicable laws.
PRIVACY NOTICE
This system is for authorized use only. Use of this system constitutes consent to security monitoring and testing. All activity is logged with your host name and IP address. Users (authorized or unauthorized) have no explicit or implicit expectation of privacy. Any or all uses of this system and all files on this system may be intercepted, monitored, recorded, copied, audited, inspected, and dis-closed to authorized site and law enforcement personnel, as well as authorized officials of other agencies, both domestic and foreign. By using this system, the user consents to such interception, monitoring, recording, copying, auditing, inspection, and disclosure at the discretion of authorized site or law enforcement personnel. Unauthorized or improper use of this system may result in administrative disciplinary action and civil and criminal penalties.
You have been inactive on this page for . You will be logged out after 03:00:00.
Select an icon below to visit the website and download an appropriate browser.
For help, please email Zintellect@orau.org.
Question: What is the deadline for submitting an application?
Answer: Not all opportunities have application deadlines. Some opportunities remain open until they are filled. If an opportunity has an application deadline, then it will be listed in the opportunity details or in the opportunity catalog.
Question: How do I reset my password?
Answer: If you have forgotten your password or wish to reset your password, use the "Forgot password or username?" tab on the login to reset it.
Question: I forgot my username. How do I retrieve it?
Answer: Use the "Forgot password or username?" tab on the login. You will receive an email containing your username.
Question: What do I need to submit an application?
Answer: Typically, applicants are required to submit a resume or CV, an official copy of their transcripts or academic record, and a minimum of two references at the time they apply. Additional requirements such as a writing sample, thesis or dissertation, etc. may be required. Review the opportunity details for additional information about the requirements for applying for an opportunity.
Question: Where do I upload my transcripts?
Answer: If required, you will be asked to upload your transcript as a part of the application process.
Question: Where do I submit a writing sample?
Answer: If required, you will be asked to upload a writing sample as part of the application process.
Question: Can a family member serve as a reference?
Answer: No; family members may not serve as references. References must be able to speak to your educational and/or professional experience. At least one academic reference is preferred.
Our Zintellect A.I. is constantly learning how to Match you to our opportunities! So, we want to know when we get it right or when we get it wrong. This will help us make our better! Plus, as a potential applicant to one of our many opportunities across the country, we value you and want to help you on your career path!
